Mitsubishi Iupilon S2001R
Iupilon S2001R is a medium viscosity, general-purpose polycarbonate (PC) resin developed by Mitsubishi Engineering-Plastics Corporation. This versatile thermoplastic is recognized for its excellent balance of physical properties, processability, and compliance with key industry standards, making it a preferred choice for a wide array of applications across various sectors.
This technical data sheet provides a comprehensive overview of Iupilon S2001R, including its key features, typical applications, and detailed tables of its physical, mechanical, thermal, and electrical properties.
Key Features
Medium Viscosity
This grade offers a balanced melt flow, making it suitable for a broad range of injection molding processes and part complexities.
Good Mold Release
The formulation includes a mold release agent, which facilitates easier demolding of finished parts, leading to improved production efficiency and reduced cycle times.
FDA Compliance
Iupilon S2001R is compliant with the U.S. Food and Drug Administration (FDA) regulations for food contact applications under 21 CFR 177.1580.
High Transparency
Like most polycarbonate resins, S2001R exhibits excellent optical clarity and high light transmittance.
Good Mechanical Strength
The material possesses a robust combination of stiffness, tensile strength, and impact resistance, ensuring the durability of molded components.
Thermal Resistance
It offers a high heat deflection temperature, allowing it to maintain its structural integrity at elevated temperatures.
Typical Applications
The well-rounded property profile of Iupilon S2001R lends itself to a diverse range of applications, including but not limited to:
General Purpose Moldings
A wide variety of housings, covers, and structural components for consumer and industrial goods.
Food Contact Articles
Reusable food containers, serving utensils, and components for food processing machinery.
Electrical and Electronic Components
Insulators, connectors, and housings where good electrical resistivity is required.
Optical Parts
Lenses, light pipes, and transparent covers that demand high clarity.
Properties of Mitsubishi Iupilon S2001R
Physical Properties
| Property | Test Method | Unit | Typical Value |
|---|---|---|---|
| Density | ISO 1183 | g/cm³ | 1.20 |
| Melt Mass-Flow Rate (MFR) | ISO 1133 | g/10 min (300°C/1.2 kg) | 10 |
| Melt Volume-Flow Rate (MVR) | ISO 1133 | cm³/10 min (300°C/1.2 kg) | 9.0 |
| Molding Shrinkage (Flow) | ISO 294-4 | % | 0.50 - 0.70 |
| Molding Shrinkage (Transverse) | ISO 294-4 | % | 0.50 - 0.70 |
| Water Absorption (Saturation, 23°C) | ISO 62 | % | 0.24 |
Mechanical Properties
| Property | Test Method | Unit | Typical Value |
|---|---|---|---|
| Tensile Modulus | ISO 527-2 | MPa | 2400 |
| Tensile Stress at Yield | ISO 527-2 | MPa | 61.0 |
| Tensile Strain at Yield | ISO 527-2 | % | 5.6 |
| Tensile Strain at Break | ISO 527-2 | % | >100 |
| Flexural Modulus | ISO 178 | MPa | 2300 |
| Flexural Strength | ISO 178 | MPa | 93.0 |
| Charpy Notched Impact Strength (23°C) | ISO 179/1eA | kJ/m² | 76 |
| Charpy Unnotched Impact Strength (23°C) | ISO 179/1eU | kJ/m² | No Break |
Thermal Properties
| Property | Test Method | Unit | Typical Value |
|---|---|---|---|
| Heat Deflection Temperature (1.8 MPa) | ISO 75-2/A | °C | 129 |
| Heat Deflection Temperature (0.45 MPa) | ISO 75-2/B | °C | 143 |
| Coefficient of Linear Thermal Expansion (Flow) | ISO 11359-2 | cm/cm/°C | 6.5 x 10⁻⁵ |
| Coefficient of Linear Thermal Expansion (Transverse) | ISO 11359-2 | cm/cm/°C | 6.6 x 10⁻⁵ |
Electrical Properties
| Property | Test Method | Unit | Typical Value |
|---|---|---|---|
| Volume Resistivity | IEC 60093 | ohm·cm | >1.0 x 10¹⁶ |
| Surface Resistivity | IEC 60093 | ohm | >1.0 x 10¹⁵ |
| Dielectric Strength (1 mm) | IEC 60243-1 | kV/mm | 31 |
| Dielectric Constant (1 MHz) | IEC 60250 | - | 3.1 |
| Dissipation Factor (1 MHz) | IEC 60250 | - | 9.0 x 10⁻³ |
Processing Recommendations for Injection Molding
To achieve optimal results when processing Iupilon S2001R, the following injection molding parameters are recommended:
| Parameter | Recommended Value |
|---|---|
| Drying Temperature | 120 °C |
| Drying Time | 3 - 5 hours |
| Melt Temperature | 280 - 300 °C |
| Mold Temperature | 80 - 100 °C |
| Injection Pressure | Medium to High |
| Holding Pressure | Medium |
| Back Pressure | Low |
Note: Proper drying of the resin is crucial to prevent hydrolytic degradation during processing, which can lead to a significant loss of mechanical properties and surface defects. A dew point of -30°C or lower for the drying air is recommended.