COVESTRO BAYBLEND T45 PG Hot Sale PC/ABS Resin
Covestro Bayblend T45 PG is an unreinforced blend of polycarbonate (PC) and acrylonitrile butadiene styrene (ABS), specifically developed by Covestro as a plating grade.
Physical Properties
- Density: Measured per ISO 1183, it is 1.10 g/cc (0.0397 lb/in³), crucial for applications where weight – volume ratios matter.
- Moisture Absorption at Equilibrium: As per ISO 62, it’s 0.20%, indicating the material’s behavior in ambient humidity.
- Water Absorption at Saturation: Based on ISO 62, it reaches 0.70%, important for water – exposed applications.
- Viscosity: According to ISO 11443 – A at 1000 1/s shear rate and 260 °C (500 °F), it’s 200000 cP, affecting flow during manufacturing.
- Linear Mold Shrinkage, Flow: For 150x105x3 mm plaques at 260 °C / MT 80 °C per ISO 2577, at 3.00 mm (0.118 in) thickness, it’s 0.0055 – 0.0075 cm/cm (0.0055 – 0.0075 in/in), key for predicting molding dimensional changes.
- Linear Mold Shrinkage, Transverse: Under the same ISO 2577 conditions, at 3.00 mm (0.118 in) thickness, it’s 0.0055 – 0.0075 cm/cm (0.0055 – 0.0075 in/in), for overall dimensional stability in molded parts.
- Melt Flow: Per ISO 1133, at 260 °C (500 °F) under 5.00 kg (11.0 lb) load, it’s 12 g/10 min, showing the material’s processability when melted.
Polymer Properties:
- Base Material: Polycarbonate – Acrylonitrile Butadiene Styrene (PC – ABS) Blend
- Key Properties:
- Suitable for electroplating applications, enabling a decorative or functional plated finish.
- High flowability, facilitating efficient injection molding processes.
- Good balance of mechanical properties, combining strength and impact resistance.
Applications:
The specific properties of Bayblend T45 PG make it an excellent material for applications that require both the look of metal and the performance of plastic.
- Automotive Interior and Exterior Components:This is a primary market for this material due to the demand for high-quality, lightweight, and durable decorative parts.
- Consumer Electronics:Many electronic devices feature decorative bezels, buttons, or trims to enhance their aesthetic appeal.
Injection Molding and Processing Conditions
To ensure the best possible results, especially for plating, precise control over the molding process is essential.
- Pre-Drying
- Purpose: Proper drying is crucial to prevent hydrolysis, which can lead to streaks, bubbles, and a poor surface finish that will compromise the plating process.
- Conditions: Dry the pellets in a dehumidifying or circulating air dryer at a temperature of 100-110°C for 2-4 hours to achieve a moisture content of ≤0.02%.
- Melt Temperature
- Recommended Range: 240-280°C. A typical melt temperature is 260°C.
- Note: Using a temperature at the higher end of the range can improve flow and surface quality, which is beneficial for plating applications, but it should be carefully balanced to avoid material degradation.
- Mold Temperature
- Recommended Range: 70-100°C. A common mold temperature is 80°C.
- Purpose: A sufficiently high mold temperature is vital for achieving a stress-free part with a high-quality surface finish. This is critical for ensuring good adhesion of the plated layer and preventing peeling or blistering.
- Other Molding Parameters
- Injection Velocity: High injection speeds are generally recommended to ensure complete mold filling and a consistent surface.
- Holding Pressure: The holding pressure should be 50-75% of the injection pressure. Maintain this pressure for the entire duration of the cooling phase to minimize shrinkage and internal stress.
- Back Pressure: Use a plasticizing back pressure of 50-150 bar to ensure a uniform melt and good color consistency.