COVESTRO BAYBLEND T65 PG Hot Sale PC/ABS Resin

COVESTRO Bayblend T65 PG is an unreinforced blend of polycarbonate (PC) and acrylonitrile butadiene styrene (ABS) from Covestro, specifically designed as a Plating Grade.

Physical Properties

  • Density: Measured in accordance with ISO 1183 – 1, the density is 1.13 g/cc (0.0408 lb/in³).
  • Moisture Absorption at Equilibrium: As per ISO 62, the moisture absorption at equilibrium is 0.20 %.
  • Water Absorption at Saturation: In accordance with ISO 62, the water absorption at saturation is 0.70 %.
  • Viscosity: At a frequency of 1000 Hz and a temperature of 260 °C (500 °F), the viscosity in the melt is 200000 cP.
  • Linear Mold Shrinkage:Per ISO 2577, 150×105×3 mm samples at 260°C/80°C, linear shrinkage 0.0050–0.0070 cm/cm (flow & transverse).
  • Melt Flow: At a temperature of 260 °C (500 °F) under a load of 5.00 kg (11.0 lb), as per ISO 1133, the melt flow rate is 20.34 g/10 min.

Polymer Properties:

  • Base Material:PC/ABS blend
  • Key Properties:
    • High rigidity and dimensional stability for precise component manufacturing.
    • Excellent impact resistance at low (-30°C) and room (23°C) temperatures.
    • Good heat resistance with elevated thermal deformation temperatures.

Applications:

  • Automotive:Used for instrument panels, door modules, and interior trims that need to withstand vehicle vibrations and temperature fluctuations while maintaining structural integrity.
  • Electronics:Applied to laptop chassis, monitor frames, and industrial device housings, leveraging its mechanical strength and heat resistance for long-term reliable performance.

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