Envalior Durethan AKV 30 H2.0 PA66 Resin

Physical Properties

• Bulk Density: Per ISO 60, the bulk density is 0.700 g/cc (0.0253 lb/in³), reflecting the material’s loose packing density before molding.
• Density: Per ISO 1183, density is 1.36 g/cc (0.0491 lb/in³), with 30% glass fibers and heat aging stabilization for prolonged high-temperature use.
• Moisture Absorption at Equilibrium: At 50% RH per ISO 62, moisture absorption is 2.0 %, comparable to standard PA66 with thermal stability additives.
• Water Absorption at Saturation: Per ISO 62, water absorption is 5.5 %, unchanged from base PA66, indicating thermal additives don’t affect hygroscopicity.
• Linear Mold Shrinkage (Flow): At 290°C/80°C per ISO 294-4, flow shrinkage is 0.0039 cm/cm (0.0039 in/in), minimal due to high fiber alignment.
• Linear Mold Shrinkage (Transverse): At 290°C/80°C per ISO 294-4, transverse shrinkage is 0.0093 cm/cm (0.0093 in/in), slightly higher but still controlled.

Polymer Properties:

• Base Material: Polyamide 66 (PA66)
• Reinforcement: 30% Glass Fiber
• Modification Features:
  
  • 30% glass fiber with heat-aging stabilization.
  • High-temperature durability for long-term use.
  • Rigid for heavy-load, high-heat environments.

Applications:

The robust combination of high rigidity, excellent dimensional stability, and impressive heat resistance makes Durethan AKV 30 H2.0 a prime choice for components that must withstand significant mechanical and thermal stress.

1. Automotive Industry: This material is widely used for under-the-hood components that require high strength and heat resistance.
   • Examples include engine mounts, radiator end tanks, thermostat housings, and air intake manifolds. 
2. Industrial and Mechanical Engineering: Due to its excellent creep and fatigue resistance.
   • It is used for structural components, gear wheels, and bearing cages in industrial machinery. 
3. Electrical and Electronics:
   • Its high dimensional stability and good electrical insulation properties make it suitable for switchgear components, coil formers, and housings for high-power electronics where heat buildup is a concern.