Envalior Durethan AKV 50 H2.0 PA66 Resin

Physical Properties

• Bulk Density: Per ISO 60, the bulk density is 0.700 g/cc (0.0253 lb/in³), indicating the material’s density in loose form before compression or molding.
• Density: According to ISO 1183, density is 1.57 g/cc (0.0567 lb/in³), with 50% glass fibers for maximum rigidity and heat resistance.
• Equilibrium Moisture Absorption: At 50% RH per ISO 62, moisture absorption is 1.4 %, the lowest in the series due to overwhelming fiber content.
• Saturation Water Absorption: Per ISO 62, water absorption is 4.0 %, significantly reduced by the high fiber-to-polymer ratio.
• Linear Mold Shrinkage (Flow): At 300°C/80°C per ISO 294-4, flow shrinkage is 0.0023 cm/cm (0.0023 in/in), dominated by glass fiber thermal properties.
• Linear Mold Shrinkage (Transverse): At 300°C/80°C per ISO 294-4, transverse shrinkage is 0.0090 cm/cm (0.0090 in/in), still low due to high fiber loading.

Polymer Properties:

• Base Material: Polyamide 66 (PA66)
• Reinforcement: 50% Glass Fiber
• Modification Features:
  
  • 50% glass fiber for extreme strength and rigidity.
  • Heat-stabilized for harsh, high-temperature environments.
  • Chemically resistant to oils and solvents.

Applications:

Durethan AKV 50 H2.0 is the material of choice for applications that demand maximum structural integrity and rigidity, especially in high-heat environments.

1. Automotive Industry: This material is perfect for load-bearing, under-the-hood components where a combination of high strength and thermal resistance is required.
   • Examples include engine mounts, transmission housings, and structural brackets. 
2. Mechanical and Industrial Engineering: Its stiffness and wear resistance make it an ideal replacement for metal in demanding applications such as heavy gears and precision machined parts.
   • It’s also used for housing and structural components in machinery that must withstand significant stress.
3. Electrical and Electronic Components: High dimensional stability and strength for structural components in high-power electronic devices and connectors operating in hot environments