COVESTRO BAYBLEND T50 XF PC/ABS Resin
Covestro Bayblend T50 XF is a flame-retardant blend of polycarbonate (PC) and acrylonitrile butadiene styrene (ABS).
Physical Properties
- Density: Measured in accordance with ISO 1183, the density is 1.11 g/cc (0.0401 lb/in³), reflecting a balanced molecular structure for general applications.
- Moisture Absorption: As per ISO 62, equilibrium moisture absorption is 0.20%, with saturated absorption at 0.70%, indicating low hygroscopicity.
- Viscosity: At 260 °C (500 °F) and 1000 Hz frequency, viscosity is 190000cP, suitable for high-flow injection molding processes.
- Linear Mold Shrinkage: Per ISO 2577, linear mold shrinkage is 0.0050–0.0070 cm/cm in both flow and transverse directions for consistent part dimensions.
- Melt Flow: Tested per ISO 1133 at 260 °C (500 °F) under 5.00 kg load, the melt flow rate is 22.61 g/10 min, ensuring good processability.
Polymer Properties:
- Base Material: Polycarbonate – Acrylonitrile Butadiene Styrene (PC – ABS) Blend
- Key Properties:
- Excellent flow for efficient injection molding of complex parts.
- Good low-temperature impact strength suitable for cold-weather applications.
Applications:
Bayblend T50 XF is specifically engineered for applications that benefit from a very high flow rate, allowing for complex geometries, thin walls, and reduced cycle times during injection molding.
Its robust property profile also ensures the final product is durable and safe.
- Consumer Electronics:The material’s outstanding flow properties make it ideal for the intricate, thin-walled housings of modern electronic devices.
- Office and IT Equipment:Bayblend T50 XF is used for components in printers, copiers, and other office machines where design complexity and fire safety are crucial.