CELANESE HOSTAFORM C 13031 K Modified POM Resin

Physical Properties

• Density: Measured per ISO 1183, the material’s density is 1.44 g/cc (0.0520 lb/in³), defining its mass per unit volume for standard evaluation.
• Water Absorption at Saturation: As per ISO 62, the material absorbs 0.65% water at saturation, indicating low moisture retention when fully submerged.
• Linear Mold Shrinkage, Flow: By ISO 294-4, flow-direction shrinkage is 0.020 cm/cm (0.020 in/in), critical for ensuring dimensional stability in molded parts.
• Linear Mold Shrinkage, Transverse: Per ISO 294-4, transverse shrinkage is 0.018 cm/cm (0.018 in/in), highlighting directional differences in component contraction.
• Melt Flow: Under ISO 1133 at 190°C/2.16 kg, the melt flow rate is 11 g/10 min [cm³/10min], reflecting good processability for injection molding.

Polymer Properties:

1. Base Material: Polyoxymethylene (POM) Copolymer
2. Modification Features:
   
   • Special chalk addition boosts rigidity and hardness, outperforming some by around 10%.
   • Exhibits outstanding resistance to solvents, fuels, and strong alkalis.
   • Maintains integrity in humid conditions with good hydrolysis resistance.
   • Offers high thermal and oxidative stability for long – term functionality.
   • Shows good abrasion resistance in parts with frequent friction.

Applications:

Hostaform® C 13031 K is used in industries where components must withstand mechanical stress, chemical exposure, and environmental challenges.

• Automotive Components:particularly for parts in contact with fuels and those requiring high strength and rigidity.
  • Fuel System Components: Its excellent resistance to fuels and solvents makes it suitable for fuel pump housings, fuel line connectors, and tank components.
  • Interior and Structural Parts: Used for clips, fasteners, and structural supports due to its enhanced mechanical properties and ability to maintain performance across a wide temperature range.
  • Data Evidence: Creep modulus and strain data (ISO 11403) indicate low deformation under sustained loads, critical for automotive components subjected to constant stress.
• Industrial Machinery and Equipment:The material’s toughness, creep resistance, and chemical stability make it suitable for industrial applications.
  • Gears and Bearings: Hostaform® C 13031 K is used for precision gears and bearings due to its high rigidity and low wear characteristics.
  • Conveyor System Components: Employed in rollers, guides, and chain links, where its low friction and high strength reduce maintenance needs.
• Consumer Goods:Hostaform® C 13031 K:rootstock: C 13031 K is used in consumer products requiring durability and aesthetic quality.
  • Appliance Components: Found in washing machine parts, such as pump housings and valve components, due to its resistance to water and detergents. 
  • Sporting Goods: Used in equipment like ski bindings and tool handles, where its strength and impact resistance are critical. 
• Medical and Food Contact Applications:Hostaform® C 13031 K complies with stringent regulatory standards, making it suitable for medical and food-contact applications.
  • Medical Devices: Used in non-implantable device components, such as surgical tool handles, due to its USP Class VI compliance and resistance to sterilization chemicals.
  • Food Processing Equipment: Applied in conveyor belts and food container parts, where its FDA and EU food contact compliance ensures safety.
  • Data Evidence: The material’s low moisture absorption (<0.5%) ensures dimensional stability in humid environments, critical for medical and food applications.
• Electrical and Electronic Components:Hostaform® C 13031 K is used in electrical housings and connectors due to its electrical insulating properties and durability.
  • Connectors and Housings: Its high dielectric strength and resistance to thermal degradation make it suitable for electrical enclosures and plug components.
  • Data Evidence: Electrical property data indicate a dielectric strength of ~30 kV/mm, ensuring reliable insulation in low- to medium-voltage applications.